Multilevel System for Thermal Design, Control and Management of Electronic Components

I. A., KHARITONOV and K. O., PETROSYANTS and N.I., RYABOV and P.A., KOZYNKO (2014) Multilevel System for Thermal Design, Control and Management of Electronic Components. In: International Conference on Advances in Computer Science and Electronics Engineering - CSEE 2014, 08-09 March, 2014, Kuala Lumpur, Malaysia.

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Abstract

The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs. The actual test validation using IR thermal measurement is demonstrated for all types of components.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: - thermal design, heat conduction, semiconductor devices, circuits and VLSIs, PCBs, packages, IR temperature control.
Depositing User: Mr. John Steve
Date Deposited: 13 May 2019 07:47
Last Modified: 13 May 2019 07:47
URI: http://publications.theired.org/id/eprint/2260

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