Test rig for welding diamond wires into a loop

CLAUDIO, ABILIO DA SILVEIRA and FABIO ANTONIO, XAVIER and JOAO, EDUARDO SOUZA DE CAMPOS and KONRAD, WEGENER and RICARDO, KNOBLAUCH and WALTER, LINDOLFO WEINGAERTNER (2017) Test rig for welding diamond wires into a loop. In: Fifth International Conference on Advances in Civil, Structural and Mechanical Engineering - CSM 2017, 02-03 September, 2017, Zurich, Switzerland.

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The multi-wire sawing of silicon using a steel wire coated with diamond grits (diamond wire) is an important process in the semiconductor and photovoltaic industry. The cut is performed in the industry by pushing a silicon ingot against a diamond wire web that moves in a pilgrim-mode (forwards and backwards). As the cut direction and cutting speed of the wire change multiple times during the operation, it is very difficult to perform a proper investigation of the cutting process. In order to study the multi-wire sawing of monocrystalline silicon (mono-Si), a new experimental setup has been proposed. Based on literature research and industry know-how, the main features necessary for the proposed wafering test rig have been defined as follows: i) use of a short wire looped segment; ii) cut with controllable constant wire speed and iii) permit to track specific diamond grains after each cut for wear analysis. In order to fulfill these prerequisites, the first step is to butt-weld diamond wires into looped shape in a wire outer diameter range of 200 < OD < 500 μm. The adopted solution is a resistance butt-welding device. In this device, the wire ends are clamped with tight alignment. By the application of electric current through the wire ends interface, heat is generated by Joule effect and the incandescent heated material is pressed together with controlled force, creating the joint. After the joint is formed, a lower electric current heats the joint for a tempering procedure to increase material ductility. The conceptual design of the device is presented, followed by details of the actual device. Butt-welds of diamond wires with OD = 200 μm and 350 μm were successfully done, resulting in welded joints with good alignment, and sufficient tensile strength for the endless wire sawing application.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: diamond wire, endless wire saw, butt-welding, resistance welding, wafering
Depositing User: Mr. John Steve
Date Deposited: 11 Mar 2019 08:29
Last Modified: 11 Mar 2019 08:29
URI: http://publications.theired.org/id/eprint/363

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